DIELECTRIC CURE MONITORING APPLICATIONS
When working on a new thermoset, the cure process is essentially unknown. What happens when the material is heated? When is the best time to apply pressure? How fast does the material react at different temperatures? Dielectric cure monitoring, or dielectric analysis (DEA) complements more conventional thermal analysis techniques of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) to bridge the gap between laboratory and manufacturing environments.