Cure Monitoring of Bulk Molding Compound (BMC)

The curing behavior of Bulk Molding Compound (BMC) was observed using the LTF‑631 High Speed Dielectric Cure Monitor. Bulk Molding Compound  is generally the same material as Sheet Molding Compound (SMC) but in bulk form, so the analysis of results can apply to SMC as well. The data from dielectric cure monitoring (DEA) clearly show:

• Critical Points identify characteristic features of the cure such as minimum ion viscosity, maximum slope of log(ion viscosity) and the time to a chosen end of cure 

• Cure time decreases and reaction rate increases as cure temperature increases, as expected for a reaction that is thermally drive