Although dielectric analysis (DEA), also known as dielectric cure monitoring, has been used for decades to study thermosets and composites, the technique is still not understood as well as other methods of thermal analysis. Employed more and more in research and development, as well as quality assurance/quality control, dielectric cure monitoring is unique because it is not confined to the laboratory and enables the same measurements, instruments and sensors to be used across the spectrum of applications from R&D to QA/QC to manufacturing.

Unlike conventional laboratory techniques, such as dynamic mechanical analysis (DMA) or differential scanning calorimetry (DSC), hands-on experience with DEA in academic polymer science programs is rare. Few opportunities exist to learn the finer points of dielectric cure monitoring and misunderstanding of even the fundamental science is still common.

A Quick Guide to Dielectric Cure Monitoring of Thermosets and Composites provides fundamental background information about DEA so the reader can grasp the utility of this method and advance to skilled use of cure monitoring.